A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers ...

A new technical paper titled “Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures” was published by ...

A new technical paper titled “Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling” was published by researchers at Carnegie Mellon University ...

A new technical paper titled “AlGaN/AlN heterostructures: an emerging platform for integrated photonics” was published by researchers at Humboldt-Universität zu Berlin and Ferdinand-Braun-Institut ...

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Researchers from the University of Utah and the University of California Irvine discovered a new type of spin-orbit torque ...