Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence's acquisition; DRAM, NAND flash; rare ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor ...

AI cannot optimize unless it can measure progress towards goals, but defining those goals is not easy, especially when ...

Semiconductor Engineering has compiled a comprehensive list of the types of packages, what’s included in them, and various processes used for assembling them. Included in this report are discussions ...

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling” ...

A new technical paper titled “An Energy Efficient Memory Cell for Quantum and Neuromorphic Computing at Low Temperatures” was ...

We have arrived at the age where atomic level precision in the fabrication of semiconductor devices is needed to keep improving PPA. Thus, advanced film fabrication techniques that provide precise ...

Memory Stochastic Computing using ReRAM” was published by researchers at TU Dresden, Center for Scalable Data Analytics and ...