A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers ...

A new technical paper titled “Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures” was published by ...

A new technical paper titled “Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling” was published by researchers at Carnegie Mellon University ...

A new technical paper titled “AlGaN/AlN heterostructures: an emerging platform for integrated photonics” was published by researchers at Humboldt-Universität zu Berlin and Ferdinand-Braun-Institut ...

Lorem Ipsum is simply dummy text of the printing and typesetting industry. Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an unknown printer took a galley of type ...

Researchers from the University of Utah and the University of California Irvine discovered a new type of spin-orbit torque ...

Flurry of regulation and fundings in U.S.; Chinese blacklist expands; materials report; new 3D interconnect process control; ...

A new technical paper titled “Monolithic 3D FPGAs Utilizing Back-End-of-Line Configuration Memories” was published by ...

A new technical paper titled “Where Do the Electrons Go? Studying Loss Processes in the Electrochemical Charging of ...

Special report on selling inference engines; managing glitch power; 2025 possibilities; AI and mundane tasks; package security; scaling AI; DRAM for AI; why offload fails; shared resources.

This will be an incredible year for innovation, driven by AI and for AI, and pushing the limits of fundamental physics.

The hardware choices for AI inference engines are chips, chiplets, and IP. Multiple considerations must be weighed.