Redistribution Layer (RDL) / Reallocation of Pads on Dies | WLP
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After copper and other conductive metals are deposited onto a wafer, a redistribution layer (RDL) re-routes conductive bumps to more desirable positions, enabling higher contact density and subsequent packaging steps. RDL is a key application in our SABRE® 3D product family — learn more. https://bit.ly/46T6old | Lam Research Corporation
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